Solvent resistance: MIL-STD-202, Method 215: No change
Vibration: MIL-STD-883, Method 2007: No change
Moisture sensitivity level: Level 1, J-STD-020
Soldering parameters:
Profile feature: Pb-Free assembly
Average ramp-up rate: 3'C/sec max
Pre heat: Temperature min: 150'C
Pre heat: Temperature max: 200'C
Pre heat: (time, min - max): 60-180 secs
Peak classification temperature: 260'C
Ramp down rate: 6'C/sec max
25'C to max temperature: 8 minutes max
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